21-0137 pdf, 21-0137 상세설명, 21-0137 데이터시트, 21-0137 view ::: ALLDATASHEET :::

부품명	21-0137

상세설명	PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 330.80MM

파일 크기	48.03 Kbytes

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제조업체	MAXIM [Maxim Integrated Products]

홈페이지	https://www.maximintegrated.com/en.html

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유사한 부품 번호 - 21-0137

제조업체	부품명	데이터시트	상세설명
Maxim Integrated Produc...	21-0132A	24Kb / 2P	PACKAGE OUTLINE, 5L, DDPAK Rev A
	21-0136F	55Kb / 2P	PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm Rev F
	21-0139	74Kb / 2P	PACKAGE OUTLINE, 12,16,20,24,28L TQFN, 440.75MM REV .L
	21-0139A	63Kb / 2P	PACKAGE OUTLINE Rev A
	21-0139	74Kb / 2P	PACKAGE OUTLINE, 12,16,20,24,28L TQFN, 440.75MM REV .L

제조업체	부품명	데이터시트	상세설명
Maxim Integrated Produc...	21-0109B	35Kb / 1P	PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD Rev B
Zetex Semiconductors	MLP322	176Kb / 3P	Surface mounted, 3 pin package Package outline
Protek Devices	DFN-2-0402	280Kb / 5P	package outline & pad layout
Maxim Integrated Produc...	21-0041	39Kb / 1P	PACKAGE OUTLINE, 8L, 14L, 16L SOIC, 150INCH Rev B
	21-0108	71Kb / 2P	PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD Rev K
	21-0111	31Kb / 1P	PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD Rev E
	21-0429	71Kb / 2P	PACKAGE OUTLINE, 10L TDFN, 320.75MM REV .C
	21-0451	41Kb / 2P	PACKAGE OUTLINE, 12L ULTRA TDFN, NIPD, 330.50MM REV .C
	21-0664	46Kb / 2P	PACKAGE OUTLINE 12L TDFN, 330.75MM REV .B
	90-0397	27Kb / 1P	PACKAGE LAND PATTERN, 12L TDFN, 3*3 Rev C