PCF2113EU datasheet(63/72 Pages) PHILIPS

63 / 72 page

2001 Dec 19

Philips Semiconductors

Product speciﬁcation

LCD controllers/drivers

PCF2113x

18 TRAY INFORMATION

Fig.35 Tray details.

handbook, full pagewidth

MGU206

For dimensions see Table 19.

Table 19 Tray dimensions

Table 20 Bump size

handbook, halfpage

MGU207

PC2113x

Fig.36 Tray alignment.

The orientation of the IC in a pocket is indicated by the position of the

IC type name on the die surface with respect to the chamfer on the

upper left corner of the tray. Refer to the bonding pad location

diagram for the orientating and position of the type name on the die

surface.

DIMENSION

DESCRIPTION

VALUE

pocket pitch x direction

6.35 mm

pocket pitch y direction

5.59 mm

pocket width x direction

3.82 mm

pocket width y direction

3.66 mm

tray width x direction

50.8 mm

tray width y direction

50.8 mm

pockets in x direction

pockets in y direction

PARAMETER

VALUE

UNIT

Type

galvanic pure Au

−

Bump width

±6

µm

Bump length

±6

µm

Bump height

17.5

±5

µm

Height difference in one die

µm

Convex deformation

µm

Pad size, aluminium

× 100

µm

Passivation opening CBB

× 76

µm

Wafer thickness

380

±25

µm

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