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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LAT676 데이터시트(PDF) 12 Page - OSRAM GmbH |
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LAT676 데이터시트(HTML) 12 Page - OSRAM GmbH |
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12 / 22 page  LA T676 12 Version 1.3 | 2018-01-26 For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Recommended Solder Pad 9) OHLPY970 2.6 (0.102) Cu-area > 16 mm Cu-Fläche > 16 mm 2 2 Solder resist Lötstopplack 2.6 (0.102) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for |
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