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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LST776 데이터시트(PDF) 11 Page - OSRAM GmbH |
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LST776 데이터시트(HTML) 11 Page - OSRAM GmbH |
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11 / 19 page  Version 1.0 (Replacement in due course) LS T776 2013-06-28 11 Recommended Solder Pad 9) page 18 Reflow soldering Empfohlenes Lötpaddesign 9) Seite 18 Reflow-Löten OHLPY977 1.2 (0.047) 6 (0.236) heat dissipation Cu-area > 16 mm Cu-Fläche > 16 mm 2 for improved Wärmeableitung für verbesserte Padgeometrie Paddesign 2 Solder resist Lötstopplack 6 (0.236) 1.2 (0.047) Hole on PCB 2.8 (0.110) 2.4 (0.094) |
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