ACE729C

4A, 16V High Efficiency Synchronous Step-Down Converter

VER 1.1

6

PCB Layout Recommendation

The device’s performance and stability are dramatically affected by PCB layout. It is recommended to

follow these general guidelines shown as below:

1.

Place the input capacitors and output capacitors as close to the device as possible. The traces which

connect to these capacitors should be as short and wide as possible to minimize parasitic inductance

and resistance.

2.

Place feedback resistors close to the FB pin.

3.

Keep the sensitive signal (FB) away from the switching signal (SW).

4.

The exposed pad of the package should be soldered to an equivalent area of metal on the PCB. This

area should connect to the GND plane and have multiple via connections to the back of the PCB as

well as connections to intermediate PCB layers. The GND plane area connecting to the exposed pad

should be maximized to improve thermal performance.

5.

Multi-layer PCB design is recommended.