14

PC755/745

2138D–HIREL–06/03

Detailed

Specification

Scope

This drawing describes the specific requirements for the microprocessor PC755, in com-

pliance with Atmel Grenoble standard screening.

Applicable Documents

1) MIL-STD-883: Test methods and procedures for electronics.

2) MIL-PRF-38535 appendix A: General specifications for microcircuits.

Requirements

General

The microcircuits are in accordance with the applicable documents and as specified

herein.

Design and Construction

Terminal Connections

Depending on the package, the terminal connections is shown in Table 1, Table 2 and

Figure 4.

Absolute Maximum Rating

Notes:

1. Functional and tested operating conditions are given in Table 5. Absolute maximum ratings are stress ratings only, and func-

tional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause

permanent damage to the device.

2. Caution: V

3. Caution: L2OV

for up to 40 ms. Excursions beyond 3.3V or 40 ms are not supported.

4. Caution: V

for up to 40 ms. Excursions beyond 1.0V or 40 ms are not supported.

5.

Table 3. Absolute Maximum Ratings

(1)

Characteristic

Symbol

Maximum Value

Unit

Core supply voltage(4)

-0.3 to 2.5

V

PLL supply voltage(4)

AV

DD

-0.3 to 2.5

V

L2 DLL supply voltage(4)

-0.3 to 2.5

V

Processor bus supply voltage(3)

OV

DD

-0.3 to 3.6

V

L2 bus supply voltage(3)

L2OV

DD

-0.3 to 3.6

V

Input voltage

Processor bus(2)(5)

V

L2 Bus(2)(5)

V

in

-0.3 to L2OV

V

JTAG Signals

V

in

-0.3 to 3.6

V

Storage temperature range

-65 to 150

°C

Rework Temperature

T

rwk

220

°C