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XCL102/XCL103

Series

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NOTE ON USE(Continued)

18) Instructions of pattern layouts

The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is high,

GND pin.

(2) Please mount each external component as close to the IC as possible.

(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.

(4) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of

switching may result in instability of the IC.

(5) This series’ internal driver transistors bring on heat because of the output current and ON resistance of P-channel and N-channel MOS driver

transistors. Please consider the countermeasures against heat if necessary.

19) Please make the equipped location accuracy within the 0.05mm as a careful point on the mounting.

<Reference pattern layout>

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TOP VIEW＞

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BOTTOM VIEW＞