MCP6S21 datasheet(5/43 Pages) MICROCHIP

5 / 43 page

 2003 Microchip Technology Inc.

DS21117A-page 5

MCP6S21/2/6/8

TEMPERATURE CHARACTERISTICS

FIGURE 1-1:

Channel Select Timing

Diagram.

FIGURE 1-2:

PGA Shutdown timing

diagram (must enter correct commands before

CS goes high).

FIGURE 1-3:

Gain Select Timing

Diagram.

FIGURE 1-4:

POR power-up and power-

down timing diagram.

Electrical Specifications: Unless otherwise indicated, VDD = +2.5V to +5.5V, VSS = GND.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Specified Temperature Range

-40

—

+85

°C

Operating Temperature Range

-40

—

+125

°C

(Note Note:)

Storage Temperature Range

-65

—

+150

°C

Thermal Package Resistances

Thermal Resistance, 8L-PDIP

θJA

—85

—

°C/W

Thermal Resistance, 8L-SOIC

θJA

—163

—

°C/W

Thermal Resistance, 8L-MSOP

θJA

—206

—

°C/W

Thermal Resistance, 14L-PDIP

θJA

—70

—

°C/W

Thermal Resistance, 14L-SOIC

θJA

—120

—

°C/W

Thermal Resistance, 14L-TSSOP

θJA

—100

—

°C/W

Thermal Resistance, 16L-PDIP

θJA

—70

—

°C/W

Thermal Resistance, 16L-SOIC

θJA

—90

—

°C/W

Note 1: The MCP6S21/2/6/8 family of PGAs operates over this extended temperature range, but with reduced

performance. Operation in this range must not cause T

J to exceed the Maximum Junction Temperature

(150°C).

VOUT

tCH

0.6V

0.3V

tOFF

VOUT

tON

Hi-Z

ISS

500 nA (typ)

1.0 mA (typ)

0.3V

VOUT

1.5V

0.3V

VDD

tRPD

VOUT

tRPU

Hi-Z

VPOR - 0.1V

VPOR + 0.1V

0.3V

ISS

500 nA (typ)

1.0 mA (typ)

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