Pad Assignment

Chip size: 2032

* The IC substrate should be connected to VDD in the PCB layout artwork.

Pad Coordinates

Unit:

mm

Pad No.

X

Y

1

-434.34

394.97

2

120.65

461.01

3

774.70

412.75

Absolute Maximum Ratings

Output Current......................................................50mA

Storage Temperature ............................

-50°Cto125°C

Power Consumption ..........................................200mW

Operating Temperature...........................

-40°Cto85°C

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those

listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-

ity.

Electrical Characteristics

Ta=25

°C

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Conditions

Hi

®Lo Detectable Voltage

¾¾

2.09

2.2

2.31

V

Lo

®Hi Detectable Voltage

¾¾

2.132

2.31

2.541

V

Hysteresis Width

¾¾

V

Operating Current

3.2V

No load

¾

1.8

4

mA

Operating Voltage

¾¾

1.6

¾

12

V

Output Sink Current

2V

0.5

1

¾

mA

D

D

V

T

DET

a

Temperature Coefficient

¾

0

°C<Ta<70°C

¾±0.9

¾

mV/

°C

HT7022A

Rev. 1.10

3

April 20, 2004

1

2

3

( 0 , 0 )