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CYUSB3314 데이터시트(PDF) 38 Page - Cypress Semiconductor

부품명 CYUSB3314
상세설명  HX3 USB 3.0 Hub
PDF  43 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  CYPRESS [Cypress Semiconductor]
홈페이지  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CYUSB3314 데이터시트(HTML) 38 Page - Cypress Semiconductor

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CYUSB330x/CYUSB331x
CYUSB332x/CYUSB230x
Document Number: 001-73643 Rev. *R
Page 38 of 43
Figure 20. 100-Ball BGA (6.0 × 6.0 × 1.0 mm) BZ100 Package Outline
N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW,
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW
DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW.
"SD" AND "SE" ARE MEASURED WITH RESPECT TO DATUMS A AND B AND
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.
"e" REPRESENTS THE SOLDER BALL GRID PITCH.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE
SOLDER BALL POSITION DESIGNATION PER JEP95, SECTION 3, SPP-020.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED SOLDER
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK
8.
7.
6.
NOTES:
5.
4.
3.
2.
1. ALL DIMENSIONS ARE IN MILLIMETERS.
SD
b
eE
eD
ME
N
0.25
0.25 BSC
0.50 BSC
0.50 BSC
0.30
100
10
0.35
DIMENSIONS
D1
MD
E1
E
D
A
A1
SYMBOL
0.16
MIN.
-
4.50 BSC
4.50 BSC
10
6.00 BSC
6.00 BSC
NOM.
-
1.00
-
MAX.
SE
0.25 BSC
D1
E1
100XØb
A
SD
SE
eE
5
6
6
Ø0.15
C
M
C
Ø0.05 M
AB
E
D
TOP VIEW
BOTTOM VIEW
SIDE VIEW
A1 CORNER
7
0.10
2X
C
eD
JEDEC SPECIFICATION NO. REF. : MO-195C.
9.
B
0.10
2X
C
C
A1
0.08 C
0.10 C
DETAIL A
(datum A)
(datum B)
DETAIL A
-
A
METALIZED MARK, INDENTATION OR OTHER MEANS.
"SD" = eD/2 AND "SE" = eE/2.
PARALLEL TO DATUM C.
"SD" OR "SE" = 0.
SIZE MD X ME.
A1 CORNER
BALLS.
A
1
2
3
4
B
C
D
E
F
G
H
65
J
7
8
9
10
K
51-85209 *F



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