21

TMP1075

www.ti.com

SBOS854 – MARCH 2018

Product Folder Links: TMP1075

Submit Documentation Feedback

Copyright © 2018, Texas Instruments Incorporated

Typical Application (continued)

8.2.2 Detailed Design Procedure

Place the TMP1075 device in close proximity to the heat source that must be monitored, with a proper layout for

good thermal coupling. This placement ensures that temperature changes are captured within the shortest

possible time interval. To maintain accuracy in applications that require air or surface temperature measurement,

take care to isolate the package and leads from ambient air temperature. A thermally-conductive adhesive is

helpful in achieving accurate surface temperature measurement.

8.2.3 Application Curve

shows the step response of the TMP1075 device to a submersion in an oil bath of 100ºC from room temperature

(27ºC). The time-constant, or the time for the output to reach 63% of the input step, is 1.5 s. The time-constant

result depends on the printed-circuit-board (PCB) that the TMPx175 devices are mounted. For this test, the

TMP1075 device were soldered to a two-layer PCB that measured 0.375 inch × 0.437 inch.