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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LAG6SP 데이터시트(PDF) 12 Page - OSRAM GmbH |
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LAG6SP 데이터시트(HTML) 12 Page - OSRAM GmbH |
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12 / 22 page  LA G6SP 12 Version 1.3 | 2018-02-01 For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Recommended Solder Pad 8) Package marking 0.6 (0.024) Lötstopplack Solder resist 0.35 (0.014) A A min 9 mm per anode pad for improved heat dissipation C A A 2 0.8 (0.031) OHLPY925 0.35 (0.014) 0.8 (0.031) Package marking |
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