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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LAM67B 데이터시트(PDF) 11 Page - OSRAM GmbH |
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LAM67B 데이터시트(HTML) 11 Page - OSRAM GmbH |
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11 / 21 page  LA M67B 11 Version 1.2 | 2018-04-16 For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Recommended Solder Pad 9) OHLPY978 Paddesign for improved heat dissipation Cu-area > 16 mm Cu-Fläche > 16 mm Wärmeableitung Padgeometrie für verbesserte Lötstopplack Solder resist 0.8 (0.031) 2.8 (0.110) 2 2 2.8 (0.110) 0.8 (0.031) |
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