4

SMP9410

SUMMIT MICROELECTRONICS, Inc.

Preliminary Information

2056 2.0 10/04/02

Temperature Under Bias ......................... –55°C to 125°C

Storage Temperature .............................. –65°C to 150°C

Terminal Voltage with Respect to GND:

All Others ....................... –0.3V to 6.0V

Output Short Circuit Current……………….……….100mA

Lead Solder Temperature (10 secs).....................300 °C

Junction Temperature.........................................150°C

ESD Rating per JEDEC……………………..………..2000V

Latch-Up testing per JEDEC……………..…......+/- 100mA

Note * - The device is not guaranteed to function outside its operating

rating. Stresses listed under Absolute Maximum Ratings may cause

permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions

outside those listed in the operational sections of this specification is

not implied. Exposure to any absolute maximum rating for extended

periods may affect device performance and reliability.

DC OPERATING CHARACTERISTICS

(Over Recommended Operating Conditions; Voltages are relative to GND)

2056 Elect TableA

Temperature ........................................... –40°C to 85°C

Voltage .................................................... 2.7V to 5.5V

Package Thermal Resistance

48 Pin TQFP = 80°C/W, 28 Pin QFN= 80°C/W

48 Pin TQFP = 40°C/W, 28 Pin QFN= 32°C/W

Moisture Classification Level 1 (MSL 1) per J-STD- 020

RELIABILITY CHARACTERISTICS

Data Retention………………………..……..…..100 Years

Endurance………………………...……….100,000 Cycles

ABSOLUTE MAXIMUM RATINGS*

RECOMMENDED OPERATING CONDITIONS

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