| 전자부품 데이터시트 검색엔진 |
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SIP32461 데이터시트(PDF) 13 Page - Vishay Siliconix |
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SIP32461 데이터시트(HTML) 13 Page - Vishay Siliconix |
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13 / 14 page ![]() Package Information www.vishay.com Vishay Siliconix S14-0844-Rev. C, 28-Apr-14 1 Document Number: 63459 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 WCSP4: 4 Bumps (2 x 2, 0.4 mm pitch, 208 μm bump height, 0.8 mm x 0.8 mm die size) DWG-No: 6004 Notes (1) Laser mark on the backside surface of die (2) Bumps are SAC396 (3) 0.05 max. coplanarity Note a. Use millimeters as the primary measurement. DIM. MILLIMETERS a INCHES MIN. NOM. MAX. MIN. NOM. MAX. A 0.515 0.530 0.545 0.0202 0.0208 0.0214 A1 0.208 0.0081 b 0.250 0.260 0.270 0.0098 0.0102 0.0106 e 0.400 0.0157 D 0.720 0.760 0.800 0.0182 0.0193 0.0203 4 x Ø b Bump Note 2 A B Pin 1 mark W B A 12 1 2 A B Mark on backside of die e D Recommended Land Pattern All dimensions in millimeters 0.4 0.4 4 x Ø 0.15 to Ø 0.20 Solder mask dia. - Pad diameter + 0.1 |
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