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TLE4998P8 데이터시트(PDF) 18 Page - Infineon Technologies AG |
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TLE4998P8 데이터시트(HTML) 18 Page - Infineon Technologies AG |
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18 / 21 page ![]() TLE4998P8(D) PG-TDSO-8 Package Outlines Data Sheet 18 Revision 1.1, 2017-01 9 PG-TDSO-8 Package Outlines Figure 9-1 PG-TDSO-8 (PG-TDSO-Plastic Green Thin Dual Small Outline), Package Dimensions 9.1 Distance Chip to package Figure 9-2 shows the distance of the chip surface to the PG-TDSO-8 surface. Figure 9-2 Distance of chip surface to package surface 9.2 Moisture Sensitivity Level (MSL) The PG-TDSO-8 fulfills the MSL level 3 according to IPC/JEDEC J-STD-033B.1. TLE4998x8D (dual die): TLE4998x8 (single die ): |
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