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LP6253HSPF 데이터시트(PDF) 9 Page - Lowpower Semiconductor inc

부품명 LP6253HSPF
상세설명  High Efficiency 8A Synchronous Boost Convertor
PDF  12 Pages
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제조업체  POWER [Lowpower Semiconductor inc]
홈페이지  http://www.lowpowersemi.com
Logo POWER - Lowpower Semiconductor inc

LP6253HSPF 데이터시트(HTML) 9 Page - Lowpower Semiconductor inc

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LP6253H
Aug.-2017
Email: marketing@lowpowersemi.com
www.lowpowersemi.com
Page 9 of 12
Preliminary Datasheet
LP6253H
Output Capacitor Selection
For lower output voltage ripple, low-ESR ceramic
capacitors are recommended. The output capacitor
must be close to the VOUT and PGND pins. The
tantalum capacitors can be used as well, but the
ESR is bigger than ceramic capacitor. The output
voltage ripple consists of two components: one is the
pulsating output ripple current flows through the ESR,
and the other is the capacitive ripple caused by
charging and discharging. The major parameter
necessary to define the output capacitor is the
maximum allowed output voltage ripple of the
converter. This ripple is determined by two
parameters of the capacitor, the capacitance and the
ESR. It is possible to calculate the minimum
capacitance needed for the defined ripple, supposing
that the ESR is zero, by using Equation:
Layout Guideline
For high frequency switching power supplies, the
PCB layout is important step in system application
design. In order to let IC achieve good regulation,
high efficiency and stability, it is strongly
recommended the power components should be
placed as close as possible. The set races should be
wide and short. The feedback pin and then works of
feedback and compensation should keep away from
the power loops, and be shielded with a ground trace
or plane to prevent noise coupling.
Implementation of integrated circuits in low-profile
and fine-pitch surface-mount packages typically
requires special attention to power dissipation. Many
system-dependent issues such as thermal coupling,
airflow, added heat sinks and convection surfaces,
and the presence of other heat-generating
components affect the power-dissipation limits of a
given component. Three basic approaches for
enhancing thermal performance are listed below:
1. Improving the power dissipation capability of the
PCB design;
2. Improving the thermal coupling of the component
to the PCB;
3. Introducing airflow in the system.



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