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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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PIC16F818-E/ML 데이터시트(PDF) 163 Page - Microchip Technology |
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PIC16F818-E/ML 데이터시트(HTML) 163 Page - Microchip Technology |
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163 / 176 page  2004 Microchip Technology Inc. DS39598E-page 161 PIC16F818/819 28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body (QFN) – With 0.55 mm Contact Length (Saw Singulated) Contact Width *Controlling Parameter Drawing No. C04-105 Notes: JEDEC equivalent: MO-220 b .009 .011 .013 0.23 0.28 0.33 Pitch Number of Pins Overall Width Standoff Overall Length Overall Height MAX Units Dimension Limits A1 D E n e A .000 INCHES .026 BSC MIN 28 NOM MAX .002 0.00 6.00 MILLIMETERS* .039 MIN 28 0.65 BSC NOM 0.05 1.00 0.90 .035 .001 0.02 Contact Length L .020 .024 .028 0.50 0.60 0.70 E2 D2 Exposed Pad Width Exposed Pad Length .140 .146 .152 3.55 3.70 3.85 .031 0.80 5.90 6.10 .240 .236 .232 .232 .236 6.00 .240 5.90 6.10 .140 .146 3.70 .152 3.55 3.85 b D2 D PAD OUTLINE ALTERNATE SEE DETAIL A1 A DETAIL TOP VIEW OPTIONAL INDEX AREA 1 2 L BOTTOM VIEW n E METAL PAD ALTERNATE EXPOSED INDICATORS INDEX e E2 Revised 05-24-04 Contact Thickness A3 .008 REF 0.20 REF |
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