MP1475 datasheet(2/16 Pages) MPS

2 / 16 page

MP1475 – SYNCHRONOUS STEP-DOWN CONVERTER

MP1475 Rev. 1.01

www.MonolithicPower.com

4/3/2014

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

MP1475DJ

TSOT-23-8

ADP

* For Tape & Reel, add suffix –Z (e.g. MP1475DJ–Z);

For RoHS Compliant Packaging, add suffix –LF (e.g. MP1475DJ–LF–Z)

PACKAGE REFERENCE

GND

VCC

EN/SYNC

BST

TOP VIEW

ABSOLUTE MAXIMUM RATINGS (1)

VIN ................................................ -0.3V to 17V

VSW ....................................................................

-0.3V (-5V for <10ns) to 17V (19V for <10ns)

VBST ...................................................... VSW+6V

All Other Pins................................-0.3V to 6V (2)

Continuous Power Dissipation (TA = +25°C)

(3)

..........................................................1.25W

Junction Temperature.............................. 150°C

Lead Temperature ................................... 260°C

Storage Temperature................. -65°C to 150°C

Recommended Operating Conditions

(4)

Supply Voltage VIN .......................... 4.5V to 16V

Output Voltage VOUT............... 0.8V to VIN x DMAX

Operating Junction Temp. (TJ). -40°C to +125°C

Thermal Resistance

(5)

θJA

θJC

TSOT-23-8 ............................ 100 ..... 55... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) About the details of EN pin’s ABS MAX rating, please refer to

Page 9, Enable/SYNC control section.

3) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on JESD51-7, 4-layer PCB.

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