2017-10-13

6

DRAFT – For Reference only.

Subject to change without notice.

Preliminary Version 0.0

SFH 2201

Handling Indication

The package is casted with silicone. Mechanical stress at the silicone surface should be avoided. Pickup

the device at the plastic frame.

Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E

0

0

s

OHA04525

50

100

150

200

250

300

50

100

150

200

250

300

t

T

˚C

S

t

t

P

t

T

p

240 ˚C

217 ˚C

245 ˚C

25 ˚C

L

OHA04612

Profile Feature

Profil-Charakteristik

25 °C to 150 °C

2

3

K/s

Time t

S

T

t

S

t

L

t

P

T

L

T

P

100

120

60

10

20

30

80

100

217

2

3

245

260

3

6

Time

25 °C to T

P

Time within 5 °C of the specified peak

temperature T

Ramp-down rate*

T

P

to

100 °C

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

T

Smax

to

T

P

Liquidus temperature

Peak temperature

Time above liquidus temperature

Symbol

Symbol

Unit

Einheit

Pb-Free (SnAgCu) Assembly

Minimum

Maximum

Recommendation

K/s

K/s

s

s

s

s

°C

°C

480