SFH 2332

2008-05-25

5

Maßzeichnung

Package Outlines

Maße in mm (inch) / Dimensions in mm (inch).

Empfohlenes Lötpaddesign

Wellenlöten (TTW)

Recommended Solder Pad

TTW Soldering

Maße in mm (inch) / Dimensions in mm (inch).

0.6 (0.024)

0.4 (0.016)

4.0 (0.157)

3.6 (0.142)

4.1 (0.161)

3.9 (0.154)

5.2 (0.205)

4.5 (0.177)

3.5 (0.138)

6.3 (0.248)

5.9 (0.232)

1.8 (0.071)

1.2 (0.047)

29 (1.142)

27 (1.063)

Chip position

Collector (Transistor)

Area not flat

GEOY6653

Cathode (Diode)

4 (0.157)

OHLPY985

cathode soldering area

area to improve power dissipation