MP8758HGL datasheet(3/23 Pages) MPS

3 / 23 page

MP8758H–22V, HIGH-CURRENT SYNCHRONOUS BUCK CONVERTER

MP8758H Rev.1.0

www.MonolithicPower.com

10/13/2015

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ABSOLUTE MAXIMUM RATINGS (1)

Supply voltage (VIN) ..................................... 24V

VSW...............................................-0.3V to 24.3V

VSW (30ns)..........................................-3V to 28V

VSW (5ns)............................................-6V to 28V

VBST ................................................... VSW + 5.5V

VEN ............................................................... 12V

Enable current (IEN)

(2)............................... 2.5mA

All other pins ................................-0.3V to +5.5V

Continuous power dissipation (TA=+25°C)

(3)

QFN-21 (3mmx4mm). ................................ 2.5W

Junction temperature ................................150

°C

Lead temperature .....................................260

°C

Storage temperature................ -65

°C to +150°C

Recommended Operating Conditions

(4)

Supply voltage (VIN) .........................4.5V to 22V

Output voltage (VOUT)..........................................

0.604V to VINxDMAX or 5.5V

Enable current (IEN)..................................... 1mA

Operating junction temp. (TJ). .. -40°C to +125°C

Thermal Resistance

(5)

θJA

θJC

QFN-21 (3mmx4mm) ..............50 ...... 12 ...

°C/W

NOTES:

1) Exceeding these ratings may damage the device.

2) For details on EN’s ABS MAX rating, please refer to the “EN

Control section on page 14.

3) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) =

(TJ(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation produces an excessive die temperature, causing

the regulator to go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on JESD51-7, 4-layer PCB.

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