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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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MP3378GY 데이터시트(PDF) 4 Page - Monolithic Power Systems |
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MP3378GY 데이터시트(HTML) 4 Page - Monolithic Power Systems |
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4 / 25 page  MP3378 – 4-CHANNEL WLED CONTROLLER PLUS BUCK CONVERTER MP3378 Rev. 1.01 www.MonolithicPower.com 4 5/26/2017 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2017 MPS. All Rights Reserved. PACKAGE REFERENCE TOP VIEW 22 21 20 19 28 27 7 8 18 17 3 4 5 6 2 GATE SYNC VIN1 PWM EN COMP VCC1 OSC ISET LED3 ADIM LED4 1 GND1 9 10 11 OVP LED2 LED1 12 15 GND2 GND2 AGND 16 BST ISENSE 13 NC NC 14 SW VIN2 26 25 24 23 FB AAM VCC2 LED3 LED4 SYNC ISET BST ADIM AGND 26 25 24 23 Exposed Pad Connect to GND ISENSE 28 27 9 10 7 8 OSC GND1 OVP NC LED1 LED2 EN COMP VCC1 PWM VIN1 GATE 20 19 22 21 3 4 5 6 1 2 GND2 SW VIN2 GND2 16 15 18 17 13 14 11 12 AAM VCC2 FB NC SOIC28 TSSOP28EP ABSOLUTE MAXIMUM RATINGS (1) WLED Driver VIN1 ........................................... -0.3 V to + 28 V VLED1 to VLED4 ............................... -1 V to + 55 V VGATE, VCC1, VISENSE .................. -0.3 V to + 6.5 V All other pins............................. –0.3 V to VCC1 Buck Converter VIN2, VSW ..................................... –0.3 V to 28 V VBST .................................................... VSW + 6 V All other pins................................. –0.3 V to 6 V Continuous power dissipation (TA = 25°C) (2) SOIC-28 ......................................................2 W TSSOP-28 EP ..........................................3.9 W Junction temperature ............................... 150°C Lead temperature .................................... 260°C Recommended Operating Conditions (3) Supply voltage (VIN1, VIN2) ................ 5 V to 24 V Operating junction temp. (TJ). .. -40°C to +125°C Thermal Resistance (4) θJA θJC SOIC-28…………………..…… 62.5……30....°C/W TSSOP-28 EP……………...…32 …….…6....°C/W NOTES: 1) Exceeding these ratings may damage the device. The voltage is measured with a 20 MHz bandwidth limited oscilloscope. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θ JA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation produces an excessive die temperature, causing the regulator to go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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