DDZ5V1B - DDZ43

Document number: DS30407 Rev. 20 - 2

7 of 8

www.diodes.com

December 2017

© Diodes Incorporated

DDZ5V1B - DDZ43

Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOD123

c

He

E

b D

All 7°

All R0.10

0

L

A

A1

All R0.10

0

All 7°

SOD123

Dim

Min

Max

Typ

A

1.00

1.35

1.05

A1

0.00

0.10

0.05

b

0.52

0.62

0.57

c

0.10

0.15

0.11

D

1.40

1.70

1.55

E

2.55

2.85

2.65

He

3.55

3.85

3.65

L

0.25

0.40

0.30

a

0º

8º

--

All Dimensions in mm

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOD123

Y

X

X1

Dimensions Value (in mm)

X

0.900

X1

4.050

Y

0.950

Note:

The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These

dimensions may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering

and is calculated by adding 0.2 mm to the „Z‟ dimension. For further information, please reference document IPC-7351A, Naming Convention for

Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Note:

For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances

between device Terminals and PCB tracking.