ADL5530

Data Sheet

Rev. C | Page 14 of 16

OUTLINE DIMENSIONS

SEATING

PLANE

0.30

0.23

0.18

0.203 REF

0.80

0.75

0.70

1.89

1.74

1.59

0.50 BSC

0.20 MIN

0.60

0.45

0.30

0.55

0.40

0.30

BOTTOM VIEW

4

1

5

8

3.25

3.00

2.75

2.25

2.00

1.75

TOP VIEW

0.05 MAX

0.02 NOM

EXPOSED PAD

PIN 1 INDEX

AREA

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 28. 8-Lead Lead Frame Chip Scale Package [LFCSP]

2 mm × 3 mm Body a

nd 0.75 mm Package Height

(CP-8-23)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Branding

ADL5530ACPZ-R7

−40°C to +85°C

8-Lead LFCSP, 7”Tape and Reel

CP-8-23

OT

ADL5530ACPZ-WP

−40°C to +85°C

8-Lead LFCSP, Waffle Pack

CP-8-23

OT

ADL5530-EVALZ

Evaluation Board