LTM4625 datasheet(20/26 Pages) LINER

20 / 26 page

LTM4625

Rev C

For more information www.analog.com

APPLICATIONS INFORMATION

Figure 19. Recommended PCB Layout

Safety Considerations

The LTM4625 modules do not provide galvanic isolation

from VIN to VOUT. There is no internal fuse. If required,

a slow blow fuse with a rating twice the maximum input

current needs to be provided to protect each unit from

catastrophic failure. The device does support thermal

shutdown and over current protection.

Layout Checklist/Example

The high integration of LTM4625 makes the PCB board

layout very simple and easy. However, to optimize its

electrical and thermal performance, some layout consid-

erations are still necessary.

• Use large PCB copper areas for high current paths,

including VIN, GND and VOUT. It helps to minimize the

PCB conduction loss and thermal stress.

• Place high frequency ceramic input and output capaci-

tors next to the VIN, PGND and VOUT pins to minimize

high frequency noise.

• Place a dedicated power ground layer underneath the

unit.

• To minimize the via conduction loss and reduce module

thermal stress, use multiple vias for interconnection

between top layer and other power layers.

• Do not put via directly on the pad, unless they are

capped or plated over.

• Use a separated SGND ground copper area for com-

ponents connected to signal pins. Connect the SGND

to GND underneath the unit.

• Bring out test points on the signal pins for monitoring.

• KeepseparationbetweenCLKIN,CLKOUTandFREQpin

traces to minimize possibility of noise due to crosstalk

between these signals.

Figure19givesagoodexampleoftherecommendedlayout.

VIN

COUT

GND

VOUT

RFB

4625 F19

GND

CIN

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