LTM4644 datasheet(21/32 Pages) LINER

21 / 32 page

LTM4634

4634f

For more information www.linear.com/LTM4634

applicaTions inForMaTion

Layout Checklist/Example

The high integration of LTM4634 makes the PCB board

layoutverysimpleandeasy.However,tooptimizeitselectri-

cal and thermal performance, some layout considerations

are still necessary.

Use large PCB copper areas for high current paths, in-

cluding VIN, GND, VOUT1, VOUT2, and VOUT3. It helps to

minimize the PCB conduction loss and thermal stress.

Place high frequency ceramic input and output capacitors

next to the VIN, GND and the VOUT pins to minimize high

frequency noise.

Place a dedicated power ground layer underneath the unit.

To minimize the via conduction loss and reduce module

thermal stress, use multiple vias for interconnection be-

tween top layer and other power layers.

Donotputviasdirectlyonthepads,unlesstheyarecapped

or plated over. Use a separated SGND ground copper area

for components connected to signal pins. Connect the

SGND to GND underneath the unit. Bring out test points

on the signal pins for monitoring. Figure 7 gives a good

example of the recommended layout.

GND

10 11 12

4634 F07

COUT1

COUT4

COUT3

COUT6

“A1” INDICATOR

CIN3

GND

VOUT1

VOUT3

GND

VIN3

VOUT3

GND

VOUT2

LTM4634Y BGA TOP VIEW

VOUT1

CIN1

FARSIDE COMPONENTS

CIN1, CIN2

CONTROL

CINTVCC

CONTROL

RFB1

RFB2

RFB3

FARSIDE COMPONENTS

COUT4, COUT5, COUT6

FARSIDE COMPONENTS

RFB1, RFB2, RFB3

CIN2

Figure 7. Recommended PCB Layout

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