LTM8063

22

8063fa

For more information www.linear.com/LTM8063

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/product/LTM8063#packaging for the most recent package drawings.

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994

2. ALL DIMENSIONS ARE IN MILLIMETERS

BALL DESIGNATION PER JEP95

4

3

DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,

BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.

THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR

MARKED FEATURE

PACKAGE TOP VIEW

PIN “A1”

CORNER

X

Y

PACKAGE BOTTOM VIEW

3

SEE NOTES

SUGGESTED PCB LAYOUT

TOP VIEW

DETAIL A

PIN 1

2.4

1.6

0.8

0.8

1.6

2.4

0.000

DETAIL A

Øb (28 PLACES)

F

G

E

A

B

C

D

1

3

2

4

D

A

DETAIL B

PACKAGE SIDE VIEW

M

X Y

Z

ddd

M Z

eee

0.40 ±0.025 Ø 28x

E

b

e

e

b

A2

F

G

BGA Package

28-Lead (6.25mm

× 4mm × 2.22mm)

(Reference LTC DWG # 05-08-1517 Rev A)

6

SEE NOTES

4

aaa Z

2

×

BGA 28 0517 REV A

TRAY PIN 1

BEVEL

PACKAGE IN TRAY LOADING ORIENTATION

COMPONENT

PIN “A1”

LTMXXXXXX

µModule

SYMBOL

A

A1

A2

b

b1

D

E

e

F

G

H1

H2

aaa

bbb

ccc

ddd

eee

MIN

2.02

0.30

1.72

0.45

0.37

0.27

1.45

NOM

2.22

0.40

1.82

0.50

0.40

6.25

4.00

0.80

4.80

2.40

0.32

1.50

MAX

2.42

0.50

1.92

0.55

0.43

0.37

1.55

0.15

0.10

0.20

0.15

0.08

TOTAL NUMBER OF BALLS: 28

DIMENSIONS

NOTES

BALL HT

BALL DIMENSION

PAD DIMENSION

SUBSTRATE THK

MOLD CAP HT

DETAIL B

SUBSTRATE

A1

ccc Z

H2

H1

b1

MOLD

CAP

5. PRIMARY DATUM -Z- IS SEATING PLANE

6

PACKAGE ROW AND COLUMN LABELING MAY VARY

AMONG µModule PRODUCTS. REVIEW EACH PACKAGE

LAYOUT CAREFULLY

!