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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LT-G6SP 데이터시트(PDF) 13 Page - OSRAM GmbH |
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LT-G6SP 데이터시트(HTML) 13 Page - OSRAM GmbH |
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13 / 22 page  Version 1.2 LT G6SP 2015-03-04 13 Recommended Solder Pad 7) page 21 Reflow soldering Empfohlenes Lötpaddesign 7) Seite 21 Reflow-Löten Note: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Anm.: Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für Ultraschallreinigung nicht geeignet. Package marking 0.6 (0.024) Lötstopplack Solder resist 0.35 (0.014) A A min 9 mm per anode pad for improved heat dissipation A A 2 0.8 (0.031) OHLP4927 0.35 (0.014) 0.8 (0.031) Package marking C |
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