LTC3728L-1

31

3728l1fc

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

.386 – .393*

(9.804 – 9.982)

GN28 (SSOP) 0204

12

3

4

5

6

7

8

9 10 11 12

.229 – .244

(5.817 – 6.198)

.150 – .157**

(3.810 – 3.988)

20

21

22

23

24

25

26

27

28

19 18 17

13 14

1615

.016 – .050

(0.406 – 1.270)

.015

± .004

(0.38

± 0.10)

× 45°

0

° – 8° TYP

.0075 – .0098

(0.19 – 0.25)

.0532 – .0688

(1.35 – 1.75)

.008 – .012

(0.203 – 0.305)

TYP

.004 – .0098

(0.102 – 0.249)

.0250

(0.635)

BSC

.033

(0.838)

REF

.254 MIN

RECOMMENDED SOLDER PAD LAYOUT

.150 – .165

.0250 BSC

.0165

±.0015

.045

±.005

*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

INCHES

(MILLIMETERS)

NOTE:

1. CONTROLLING DIMENSION: INCHES

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

5.00 ± 0.10

(4 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE

M0-220 VARIATION WHHD-(X) (TO BE APPROVED)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40 ± 0.10

31

1

2

32

BOTTOM VIEW—EXPOSED PAD

3.50 REF

(4-SIDES)

3.45 ± 0.10

3.45 ± 0.10

0.75 ± 0.05

R = 0.115

TYP

0.25 ± 0.05

(UH32) QFN 0406 REV D

0.50 BSC

0.200 REF

0.00 – 0.05

0.70 ±0.05

3.50 REF

(4 SIDES)

4.10 ±0.05

5.50 ±0.05

0.25 ± 0.05

PACKAGE

OUTLINE

0.50 BSC

RECOMMENDED SOLDER PAD LAYOUT

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

PIN 1 NOTCH R = 0.30 TYP

OR 0.35 × 45° CHAMFER

R = 0.05

TYP

3.45 ± 0.05

3.45 ± 0.05

UH Package

32-Lead Plastic QFN (5mm

× 5mm)

(Reference LTC DWG # 05-08-1693 Rev D)

GN Package

28-Lead Plastic SSOP (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1641)