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LS-M676 데이터시트(PDF) 13 Page - OSRAM GmbH |
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LS-M676 데이터시트(HTML) 13 Page - OSRAM GmbH |
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13 / 15 page ![]() LS M676, LA M676, LO M676, LY M676 2002-10-18 13 Empfohlenes Lötpaddesign IR Reflow Löten Recommended Solder Pad IR Reflow Soldering Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch) Gehäuse hält TTW-Löthitze aus / Package able to withstand TTW-soldering heat OHLPY978 Paddesign for improved heat dissipation Cu-area > 16 mm Cu-Fläche > 16 mm Wärmeableitung Padgeometrie für verbesserte Lötstopplack Solder resist 0.8 (0.031) 2.8 (0.110) 2 2 2.8 (0.110) 0.8 (0.031) |
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