Data Sheet

HMC902LP3E

Rev. E | Page 5 of 13

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

NIC

NIC

GND

NIC

NIC

GND

GND

HMC902LP3E

TOP VIEW

(Not to Scale)

PACKAGE

BASE

12

11

10

9

1

3

4

2

NOTES

1. NIC = NOT INTERNALLY CONNECTED. HOWEVER, ALL DATA

SHOWN IN THIS DATA SHEET IS MEASURED WITH THESE

PINS CONNECTED TO RF/DC GROUND EXTERNALLY.

2. EXPOSED PAD. THE PACKAGE BOTTOM HAS AN EXPOSED

METAL GROUND PADDLE THAT MUST BE CONNECTED TO

RF/DC GROUND.

Figure 2. Pin Configuration

Table 3. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 2, 5, 8, 11 to

13, 16

NIC

Not Internally Connected. However, all data shown in this data sheet is measured with these pins

connected to RF/dc ground externally.

3

RF Input. This pin is ac-coupled and matched to 50 Ω. See Figure 3 for the interface schematic.

4, 9

GND

Ground. Connect these pins to RF/dc ground. See Figure 4 for the interface schematic.

6, 7

Optional Gate Control for Amplifier. If left open, the amplifier runs self biased at the standard current.

Applying a negative voltage reduces drain current. External capacitors are required (see Figure 24). See

Figure 5 for the interface schematic.

10

RF Output. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the interface schematic.

14, 15

Power Supply Voltage for the Amplifier. See Figure 23 and Figure 24 for the application circuits. See Figure 7

for the interface schematic.

EPAD

Exposed Pad. The package bottom has an exposed metal ground paddle that must be connected to RF/dc

ground.

INTERFACE SCHEMATICS

GND

Figure 4. GND Interface Schematic