K64F datasheet(21/85 Pages) NXP

21 / 85 page

Table 13. Thermal attributes (continued)

Board type

Symbol

Descriptio

144 LQFP

144

MAPBGA

121

XFBGA

100 LQFP

Unit

Notes

junction to

case

—

ΨJT

Thermal

characteriza

tion

parameter,

junction to

package top

outside

center

(natural

convection)

0.9

0.2

°C/W

1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental

Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test

Method Environmental Conditions—Forced Convection (Moving Air).

2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental

Conditions—Junction-to-Board.

3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate

temperature used for the case temperature. The value includes the thermal resistance of the interface material

between the top of the package and the cold plate.

4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental

Conditions—Natural Convection (Still Air).

3 Peripheral operating requirements and behaviors

3.1 Core modules

3.1.1 Debug trace timing specifications

Table 14. Debug trace operating behaviors

Symbol

Description

Min.

Max.

Unit

Tcyc

Clock period

Frequency dependent

MHz

Twl

Low pulse width

—

Twh

High pulse width

—

Clock and data rise time

—

Clock and data fall time

—

Data setup

1.5

—

Data hold

—

Peripheral operating requirements and behaviors

Kinetis K64F Sub-Family Data Sheet, Rev. 7, 11/2016

NXP Semiconductors

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