PCA2002USLASHAA datasheet(12/20 Pages) PHILIPS

12 / 20 page

2004 Jan 20

Philips Semiconductors

Product speciﬁcation

32 kHz watch circuit with programmable

output period and pulse width

PCA2002

BONDING PAD LOCATIONS

Notes

1. All coordinates are referenced, in

µm, to the centre of

the die (see Fig.11).

2. The substrate (rear side of the chip) is connected to

VSS. Therefore, the die pad must be either floating or

connected to VSS.

3. Pad i.c. is used for factory tests; in normal operation it

should be left open-circuit, and it has an internal

pull-down resistance to VSS.

Table 5

Mechanical chip data; note 1

Note

1. The substrate of the chip is connected to VSS. The

pad i.c. is used for factory test, in normal operation it

should be left open-circuit. The pad i.c. has an internal

pull-down resistor connected to VSS.

SYMBOL

PAD

COORDINATES(1)

VSS(2)

−480

+330

i.c.(3)

−480

+160

OSCIN

−480

−160

OSCOUT

−480

−330

VDD

+480

−330

MOT1

+480

−160

MOT2

+480

+160

RESET

+480

+330

PARAMETER

VALUE

Bonding pad:

metal

× 96 µm

opening

× 86 µm

handbook, halfpage

MBL574

0.90 mm

VDD

MOT2

MOT1

RESET

VSS

i.c.

OSCIN

OSCOUT

1.20 mm

Fig.11 Bonding pad locations.

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