Philips Semiconductors

PCA9545A

9397 750 14311

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Product data sheet

Rev. 03 — 3 March 2005

21 of 27

Fig 22. Package outline SOT662-1 (HVQFN20)

0.65

1

A1

Eh

b

UNIT

y

e

0.2

c

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

5.1

4.9

Dh

3.25

2.95

y1

5.1

4.9

3.25

2.95

e1

2.6

e2

2.6

0.38

0.23

0.05

0.00

0.05

0.1

DIMENSIONS (mm are the original dimensions)

SOT662-1

MO-220

- - -

- - -

0.75

0.50

L

0.1

v

0.05

w

0

2.5

5 mm

scale

SOT662-1

HVQFN20: plastic thermal enhanced very thin quad flat package; no leads;

20 terminals; body 5 x 5 x 0.85 mm

max.

A

A1

c

detail X

y

y1 C

e

L

Eh

Dh

e

e1

b

610

20

16

15

11

5

1

X

D

E

C

B

A

e2

terminal 1

index area

terminal 1

index area

01-08-08

02-10-22

A

C

C

B

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.