| 전자부품 데이터시트 검색엔진 |
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LCW-G6CP 데이터시트(PDF) 19 Page - OSRAM GmbH |
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LCW-G6CP 데이터시트(HTML) 19 Page - OSRAM GmbH |
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19 / 28 page ![]() Version 1.2 LCW G6CP 2015-04-30 19 Recommended Solder Pad 7) page 27 Reflow soldering Empfohlenes Lötpaddesign 7) Seite 27 Reflow-Löten Note: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Anm.: Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für Ultraschallreinigung nicht geeignet. Package marking 0.6 (0.024) Lötstopplack Solder resist 0.35 (0.014) A A min 9 mm per anode pad for improved heat dissipation A A 2 0.8 (0.031) OHLP4927 0.35 (0.014) 0.8 (0.031) Package marking C |
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