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ISL9222 데이터시트(PDF) 3 Page - Renesas Technology Corp |
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ISL9222 데이터시트(HTML) 3 Page - Renesas Technology Corp |
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3 / 8 page ![]() ISL9222 FN6643 Rev 1.00 Page 3 of 8 March 10, 2008 Pin Descriptions VIN - Power input. The absolute maximum input voltage is 28V. A 1µF or larger value X5R ceramic capacitor is recommended to be placed very close to the input pin for decoupling purpose. Additional capacitance may be required to provide a stable input voltage. PPR - Open-drain power presence indication. The open-drain MOSFET turns on when the input voltage is above the POR threshold but below the OVP threshold and off otherwise. This pin is capable to sink 10mA (minimum) current to drive an LED. The maximum voltage rating for this pin is 7V. This pin is independent on the EN-pin input. JIGON - Output pin of the auxiliary 2-input OR gate. One of the inputs is internal and is connected to the inverted PPR logic. The other input is from the JIGIN pin driven externally to provide system booting enable signal. EN - Enable input. This is a logic input pin to disable or enable the charger. Drive to HIGH to disable the charger. When this pin is driven to LOW or left floating, the charger is enabled. This pin has an internal 200k pull-down resistor. GND - System ground. JIGIN - One of the inputs of the 2-input auxiliary OR gate. There is a 240k pull down resistor at this pin. IREF - Charge-current program and monitoring pin. Connect a resistor between this pin and the GND pin to set the charge current limit determined by Equation 1: Where RIREF is in k. The IREF pin voltage also monitors the actual charge current during the entire charge cycle, including the trickle, constant-current, and constant-voltage phases. When disabled, VIREF = 0V. BAT - Charger output pin. Connect this pin to the battery. A 1µF or larger X5R ceramic capacitor is recommended for decoupling and stability purposes. When the EN pin is pulled to logic HIGH, the BAT output is disabled. EPAD - Exposed pad. Connect as much copper as possible to this pad either on the component layer or other layers through thermal vias to enhance the thermal performance. LOGIC INPUT AND OUTPUTS EN Pin Logic Input High VIH 1.3 - - V EN Pin Logic Input Low VIL -- 0.5 V EN Pin Internal Pull-Down Resistance 100 200 400 k PPR Sink Current when LOW Pin Voltage = 1V 10 20 - mA PPR Leakage Current When HIGH VPPR = 6.5V - - 1 µA AUXILIARY OR GATE Supply Voltage VS 2.5 - 5.0 V JIGON High Level Output Voltage VOH IJIGON(SOURCE) = -60A, 2.5V < VBAT < 5.0V VBAT - 0.1V -- V IJIGON(SOURCE) = -1mA, 3.0V < VBAT < 5.0V VBAT- 0.45V -- V JIGON Out Put Low Voltage VOL IJIGON(SINK) = 1mA - - 0.1 V JIGIN Pin Logic Input High VIH VBAT = 2.5V 2.1 - - V 3.0V < VBAT < 5.0V 0.75 x VBAT -- V JIGIN Pin Logic Input Low VIL VBAT = 2.5V - - 0.4 V 3.0V < VBAT < 5.0V - - 0.25x VBAT V JIGIN Pin Internal Pull-Down Resistance 100 240 400 k NOTES: 3. The output is used to test the VOS threshold. The output current will toggle between 0 and the CC current when VOS crosses over the threshold. 4. For junction temperature below +100°C. 5. The charge current can be affected by the thermal foldback function if the IC under the test setup cannot dissipate the heat. Electrical Specifications Typical values are tested at VIN = 5V and the ambient temperature at +25°C. All maximum and minimum values are established under the recommended operating supply voltage range and ambient temperature range, unless otherwise noted. (Continued) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS IREF 12089 RIREF ----------------- mA = (EQ. 1) |
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