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ISL9222 데이터시트(PDF) 3 Page - Renesas Technology Corp

부품명 ISL9222
상세설명  High Input Voltage Charger
PDF  8 Pages
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제조업체  RENESAS [Renesas Technology Corp]
홈페이지  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

ISL9222 데이터시트(HTML) 3 Page - Renesas Technology Corp

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ISL9222
FN6643 Rev 1.00
Page 3 of 8
March 10, 2008
Pin Descriptions
VIN - Power input. The absolute maximum input voltage is
28V. A 1µF or larger value X5R ceramic capacitor is
recommended to be placed very close to the input pin for
decoupling purpose. Additional capacitance may be required
to provide a stable input voltage.
PPR - Open-drain power presence indication. The
open-drain MOSFET turns on when the input voltage is
above the POR threshold but below the OVP threshold and
off otherwise. This pin is capable to sink 10mA (minimum)
current to drive an LED. The maximum voltage rating for this
pin is 7V. This pin is independent on the EN-pin input.
JIGON - Output pin of the auxiliary 2-input OR gate. One of
the inputs is internal and is connected to the inverted PPR
logic. The other input is from the JIGIN pin driven externally
to provide system booting enable signal.
EN - Enable input. This is a logic input pin to disable or
enable the charger. Drive to HIGH to disable the charger.
When this pin is driven to LOW or left floating, the charger is
enabled. This pin has an internal 200k
 pull-down resistor.
GND - System ground.
JIGIN - One of the inputs of the 2-input auxiliary OR gate.
There is a 240k
 pull down resistor at this pin.
IREF - Charge-current program and monitoring pin. Connect
a resistor between this pin and the GND pin to set the
charge current limit determined by Equation 1:
Where RIREF is in k. The IREF pin voltage also monitors
the actual charge current during the entire charge cycle,
including the trickle, constant-current, and constant-voltage
phases. When disabled, VIREF = 0V.
BAT - Charger output pin. Connect this pin to the battery. A
1µF or larger X5R ceramic capacitor is recommended for
decoupling and stability purposes. When the EN pin is pulled
to logic HIGH, the BAT output is disabled.
EPAD - Exposed pad. Connect as much copper as possible
to this pad either on the component layer or other layers
through thermal vias to enhance the thermal performance.
LOGIC INPUT AND OUTPUTS
EN Pin Logic Input High
VIH
1.3
-
-
V
EN Pin Logic Input Low
VIL
--
0.5
V
EN Pin Internal Pull-Down Resistance
100
200
400
k
PPR Sink Current when LOW
Pin Voltage = 1V
10
20
-
mA
PPR Leakage Current When HIGH
VPPR = 6.5V
-
-
1
µA
AUXILIARY OR GATE
Supply Voltage
VS
2.5
-
5.0
V
JIGON High Level Output Voltage
VOH
IJIGON(SOURCE) = -60A, 2.5V < VBAT < 5.0V
VBAT -
0.1V
--
V
IJIGON(SOURCE) = -1mA, 3.0V < VBAT < 5.0V
VBAT-
0.45V
--
V
JIGON Out Put Low Voltage
VOL
IJIGON(SINK) = 1mA
-
-
0.1
V
JIGIN Pin Logic Input High
VIH
VBAT = 2.5V
2.1
-
-
V
3.0V < VBAT < 5.0V
0.75 x
VBAT
--
V
JIGIN Pin Logic Input Low
VIL
VBAT = 2.5V
-
-
0.4
V
3.0V < VBAT < 5.0V
-
-
0.25x
VBAT
V
JIGIN Pin Internal Pull-Down Resistance
100
240
400
k
NOTES:
3. The output is used to test the VOS threshold. The output current will toggle between 0 and the CC current when VOS crosses over the threshold.
4. For junction temperature below +100°C.
5. The charge current can be affected by the thermal foldback function if the IC under the test setup cannot dissipate the heat.
Electrical Specifications
Typical values are tested at VIN = 5V and the ambient temperature at +25°C. All maximum and minimum
values are established under the recommended operating supply voltage range and ambient temperature
range, unless otherwise noted. (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
IREF
12089
RIREF
-----------------
mA

=
(EQ. 1)



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