ICL7663S

FN3180 Rev 6.00

Page 2 of 8

October 2, 2015

Ordering Information

PART NUMBER

TEMP. RANGE

(°C)

PACKAGE

PKG. DWG. #

ICL7663SCBA* (No longer

available, recommended replacement:

ICL7663SCBAZA)

0 to 70

8 Ld SOIC (N)

M8.15

ICL7663SCBAZA*

(See Note)

0 to 70

8 Ld SOIC (N)

(Pb-free)

M8.15

ICL7663SCPA (No longer

available, recommended replacement:

ICL7663SCPAZ)

0 to 70

8 Ld PDIP

E8.3

ICL7663SCPAZ

(See Note)

0 to 70

8 Ld PDIP**

(Pb-free)

E8.3

ICL7663SACBA* (No longer

available, recommended replacement:

ICL7663SACBAZA, ICL7663SACBAZA-T)

0 to 70

8 Ld SOIC (N)

M8.15

ICL7663SACBAZA*

(See Note)

0 to 70

8 Ld SOIC (N)

(Pb-free)

M8.15

ICL7663SACPA

0 to 70

8 Ld PDIP

E8.3

ICL7663SAIBAZA

(See Note)

-25 to 85

8 Ld SOIC (N)

(Pb-free)

M8.15

*Add “-T” suffix to part number for tape and reel packaging.

**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin

plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are

MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.