C

C

C

REF

DIG1

Microcontroller

A/D Input

Via

to GND

Plane

Via to

Input Power

Analog Input

GND

EN

REF

V+

GND

OUT

IN-

IN+

AIN

C

C

24

REF2025, REF2030, REF2033, REF2041

SBOS600C – MAY 2014 – REVISED JANUARY 2017

www.ti.com

Product Folder Links: REF2025 REF2030 REF2033 REF2041

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Copyright © 2014–2017, Texas Instruments Incorporated

12 Layout

12.1 Layout Guidelines

Figure 58 shows an example of a PCB layout for a data acquisition system using the REF2030. Some key

considerations are:

•

•

Decouple other active devices in the system per the device specifications.

•

Using a solid ground plane helps distribute heat and reduces electromagnetic interference (EMI) noise pickup.

•

Place the external components as close to the device as possible. This configuration prevents parasitic errors

(such as the Seebeck effect) from occurring.

•

Minimize trace length between the reference and bias connections to the INA and ADC to reduce noise

pickup.

•

Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if

possible, and only make perpendicular crossings when absolutely necessary.

12.2 Layout Example

Figure 58. Layout Example