LT1794CSW datasheet(18/20 Pages) LINER

부품명	LT1794CSW

상세설명	Dual 500mA, 200MHz xDSL Line Driver Amplifier

PDF	20 Pages

Scroll/Zoom	100%

제조업체	LINER [Linear Technology]

홈페이지	http://www.linear.com

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18 / 20 page

LT1794

PACKAGE DESCRIPTIO

Dimensions in inches (millimeters) unless otherwise noted.

FE20 (CA) TSSOP 0203

0.09 – 0.20

(.0036 – .0079)

° – 8°

RECOMMENDED SOLDER PAD LAYOUT

0.45 – 0.75

(.018 – .030)

4.30 – 4.50*

(.169 – .177)

6.40

BSC

6 7 89 10

14 13

6.40 – 6.60*

(.252 – .260)

4.95

(.195)

2.74

(.108)

20 1918 17 16 15

1.20

(.047)

MAX

0.05 – 0.15

(.002 – .006)

0.65

(.0256)

BSC

0.195 – 0.30

(.0077 – .0118)

2.74

(.108)

0.45

±0.05

0.65 BSC

4.50

±0.10

6.60

±0.10

1.05

±0.10

4.95

(.195)

MILLIMETERS

(INCHES)

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

SEE NOTE 4

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

FE Package

20-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1663)

Exposed Pad Variation CA

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