EL5423 datasheet(11/17 Pages) RENESAS

11 / 17 page

EL5123, EL5223, EL5323, EL5423

FN7176 Rev 3.00

Page 11 of 17

August 31, 2010

FIGURE 19. LARGE SIGNAL TRANSIENT RESPONSE

FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

FIGURE 22. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

FIGURE 23. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE

Typical Performance Curves (Continued)

1µs/DIV

1V/DIV

JEDEC JESD51-7 HIGH EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD, QFN EXPOSED

DIEPAD SOLDERED TO PCB PER JESD51-5

3.0

2.5

2.0

1.5

1.0

0.5

100

125

150

AMBIENT TEMPERATURE (°C)

2.857W

2.703W

JA = +37°C/W

QFN24

JA = +35°C/W

QFN32

JEDEC JESD51-3 AND SEMI G42-88

(SINGLE LAYER) TEST BOARD

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

714mW

JA = +140°C/W

QFN24

JA = +132°C/W

QFN32

100

125

150

AMBIENT TEMPERATURE (°C)

758mW

JEDEC JESD51-7 HIGH EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

1.4

1.2

1.0

0.8

0.6

0.4

0.2

100

125

150

AMBIENT TEMPERATURE (°C)

1.111W

1.333W

870mW

JA = +95°C/W

TSSOP20

JA = +115°C/W

MSOP10

JA = +85°C/W

TSSOP24

JA = +75°C/W

TSSOP28

1.176W

JEDEC JESD51-3 LOW EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

100

125

150

AMBIENT TEMPERATURE (°C)

486mW

JA = +206°C/W

MSOP10

714mW

JA = +140°C/W

TSSOP20

JA = +120°C/W

TSSOP28

JA = +128°C/W

TSSOP24

833mW

781mW

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