ISL97698

FN8417 Rev.1.00

Page 21 of 21

Sep 7, 2017

Package Outline Drawing

W3x4.12A

3X4 ARRAY 12 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) (BSC)

Rev 1, 1/13

BOTTOM VIEW

RECOMMENDED LAND PATTERN

TOP VIEW

SIDE VIEW

NOTES:

1. All dimensions are in millimeters.

2. Dimensions and tolerance and tolerance per ASMEY 14.5 - 1994,

and JESD 95-1 SPP-010.

3. NSMD refers to non-solder mask defined pad design per Intersil

Tech Brief www.intersil.com/data/tb/tb451.pdf

NSMD

PACKAGE

(4X)

X

Y

Z SEATING PLANE

3

PIN 1

0.265±0.035

0.200±0.030

0.540±0.050

0.040 BSC

A

B

3

C

12

1.39±0.030

1.69±0.030

0.800

1.200

D

0.400

0.400

0.245

0.295

12x 0.265±0.035

0.290

0.240

(A1 CORNER)

0.10

Z X Y

0.05

Z

0.05 Z

0.10

OUTLINE

(BACKSIDE COATING)

For the most recent package outline drawing, see W3x4.12A.