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BVB // Size 2725

Mechanical dimensions and pcb-layout proposal (Reflow-soldering) [mm] // Drawing no. Z-YH-180

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Specification

Parameters

Test conditions

Specified values

temperature cycling

2000 cycles (-55 °C to +150 °C)

±0.5%

Low temperature Storage and operation

-65 °C for 250 h

±0.1%

resistance to Soldering Heat

260 °C for 10 sec / 8h steam aging

n.a.

Moisture resistance

MIL-StD-202 method 106

±0.1%

Mechanical Shock

100 g, 6 ms half sine

±0.2%

Vibration, High Frequency

10 g, 10-2000 Hz, 24 h each axis

±0.2%

operational Life

2000 h, t

±1.0%, t

High temperature Exposure

2000 h / 170 °C

±1.0% (in covered condition) *

Bias Humidity

+85 °C, 85 r.F., 1000 h

±0.5%