DPG60B600LB

Low Loss and Soft Recovery

High Performance Fast Recovery Diode

1~ Rectifier Bridge

HiPerFRED

6

9

1

7

5

4

2

3

8 = n/c

Part number

DPG60B600LB

Backside: isolated

DAV

rr

t

ns

40

RRM

60

600

=

V

=

V

I

=

A

Features / Advantages:

Applications:

Package:

● Planar passivated chips

● Very low leakage current

● Very short recovery time

● Improved thermal behaviour

● Very low Irm-values

● Very soft recovery behaviour

● Avalanche voltage rated for reliable operation

● Soft reverse recovery for low EMI/RFI

● Low Irm reduces:

- Power dissipation within the diode

- Turn-on loss in the commutating switch

● Rectifiers in switch mode power

supplies (SMPS)

SMPD

● Industry convenient outline

● RoHS compliant

● Epoxy meets UL 94V-0

● Soldering pins for PCB mounting

● Backside: DCB ceramic

● Reduced weight

● Advanced power cycling

● Isolation Voltage:

V~

3000

The data contained in this product data sheet is exclusively intended for technically trained staff. The user will have to evaluate the suitability of the product for the intended application and

the completeness of the product data with respect to his application. The specifications of our components may not be considered as an assurance of component characteristics. The

information in the valid application- and assembly notes must be considered. Should you require product information in excess of the data given in this product data sheet or which concerns

the specific application of your product, please contact your local sales office.

Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact your local sales office.

Should you intend to use the product in aviation, in health or life endangering or life support applications, please notify. For any such application we urgently recommend

- to perform joint risk and quality assessments;

- the conclusion of quality agreements;

- to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures.

Terms Conditions of usage:

IXYS reserves the right to change limits, conditions and dimensions.

20140108a

Data according to IEC 60747and per semiconductor unless otherwise specified

© 2014 IXYS all rights reserved