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ISL3175EIBZ 데이터시트(PDF) 21 Page - Renesas Technology Corp |
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ISL3175EIBZ 데이터시트(HTML) 21 Page - Renesas Technology Corp |
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21 / 21 page ![]() ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E FN6307 Rev.6.00 Page 21 of 21 Aug 31, 2017 Package Outline Drawing M14.15 14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 1, 10/09 A D 4 0.25 A-B MC C 0.10 C 5 B D 3 0.10 A-B C 4 0.20 C 2X 2X 0.10 D C 2X H 0.10 C 6 3 6 ID MARK PIN NO.1 (0.35) x 45° SEATING PLANE GAUGE PLANE 0.25 (5.40) (1.50) 1.27 0.31-0.51 4° ± 4° DETAIL"A" 0.22±0.03 0.10-0.25 1.25 MIN 1.75 MAX (1.27) (0.6) 6.0 8.65 3.9 7 14 8 Dimensioning and tolerancing conform to AMSEY14.5m-1994. Dimension does not include interlead flash or protrusions. Dimensions in ( ) for Reference Only. Interlead flash or protrusions shall not exceed 0.25mm per side. Datums A and B to be determined at Datum H. 4. 5. 3. 2. Dimensions are in millimeters. NOTES: 1. The pin #1 indentifier may be either a mold or mark feature. 6. Does not include dambar protrusion. Allowable dambar protrusion 7. Reference to JEDEC MS-012-AB. shall be 0.10mm total in excess of lead width at maximum condition. DETAIL "A" SIDE VIEW TYPICAL RECOMMENDED LAND PATTERN TOP VIEW For the most recent package outline drawing, see M14.15. |
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