| 전자부품 데이터시트 검색엔진 |
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IXD1209 데이터시트(PDF) 21 Page - Zilog, Inc. |
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IXD1209 데이터시트(HTML) 21 Page - Zilog, Inc. |
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21 / 27 page ![]() IXD1209/12 © 2014 IXYS Corp. 21 Doc. No. IXD1209/12_DS, Rev. N0 Characteristics subject to change without notice PACKAGE POWER DISSIPATION SOT-25 Power Dissipation The power dissipation varies with the mount board conditions. Please use this data as a reference only. 1. Measurement Conditions: Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40×40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area on top and bottom layers Package heat sink tied to the copper traces. (Board of SOT-26 is used) Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 2. Power Dissipation vs. Ambient Temperature Board Mount (Tjmax = 125 0C) Ambient Temperature, 0C Power Dissipation Pd, mW Thermal Resistance, 0C/W 25 600 166.67 85 240 |
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