ADA4433-1BCPZ-R7 datasheet(24/25 Pages) AD

24 / 25 page

ADA4432-1/ADA4433-1

Data Sheet

Rev. E | Page 24 of 25

OUTLINE DIMENSIONS

Figure 58. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-21)

Dimensions shown in millimeters

Figure 59. 6-Lead Small Outline Transistor Package [SOT-23]

(RJ-6)

Dimensions shown in millimeters

2.44

2.34

2.24

TOP VIEW

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.70

1.60

1.50

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

PIN 1

INDICATOR

(R 0.15)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED

0.20 MIN

COMPLIANT TO JEDEC STANDARDS MO-178-AB

10°

4°

0°

SEATING

PLANE

1.90

BSC

0.95 BSC

0.60

BSC

3.00

2.90

2.80

3.00

2.80

2.60

1.70

1.60

1.50

1.30

1.15

0.90

0.15 MAX

0.05 MIN

1.45 MAX

0.95 MIN

0.20 MAX

0.08 MIN

0.50 MAX

0.30 MIN

0.55

0.45

0.35

PIN 1

INDICATOR

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