LT6013/LT6014

15

60134fa

PACKAGE DESCRIPTIO

DD Package

8-Lead Plastic DFN (3mm

× 3mm)

(Reference LTC DWG # 05-08-1698)

3.00

±0.10

(4 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON TOP AND BOTTOM OF PACKAGE

0.38

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65

± 0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

2.38

±0.10

(2 SIDES)

1

4

8

5

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

0.00 – 0.05

(DD8) DFN 1203

0.25

± 0.05

2.38

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65

±0.05

(2 SIDES)

2.15

±0.05

0.50

BSC

0.675

±0.05

3.5

±0.05

PACKAGE

OUTLINE

0.25

± 0.05

0.50 BSC

S8 Package

8-Lead Plastic Small Outline (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1610)

.016 – .050

(0.406 – 1.270)

.010 – .020

(0.254 – 0.508)

× 45°

0

°– 8° TYP

.008 – .010

(0.203 – 0.254)

SO8 0303

.053 – .069

(1.346 – 1.752)

.014 – .019

(0.355 – 0.483)

TYP

.004 – .010

(0.101 – 0.254)

.050

(1.270)

BSC

1

2

3

4

.150 – .157

(3.810 – 3.988)

NOTE 3

8

7

6

5

.189 – .197

(4.801 – 5.004)

NOTE 3

.228 – .244

(5.791 – 6.197)

.245

MIN

.160

±.005

RECOMMENDED SOLDER PAD LAYOUT

.045

±.005

.050 BSC

.030

±.005

TYP

INCHES

(MILLIMETERS)

NOTE:

1. DIMENSIONS IN

2. DRAWING NOT TO SCALE

3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.