TC1302A/B

DS21333B-page 4

© 2005 Microchip Technology Inc.

TEMPERATURE SPECIFICATIONS

Shutdown Supply Current

TC1302A

—58

90

µA

SHDN2 = GND

Shutdown Supply Current

TC1302B

—

0.1

1

µA

SHDN1 = SHDN2 = GND

Power Supply Rejection Ratio

PSRR

—

58

—

dB

f

Output Noise

eN

—

830

—

Output Short Circuit Current (Average)

—

200

—

mA

—

140

—

mA

SHDN Input High Threshold

45

——

SHDN Input Low Threshold

——

15

Wake Up Time (From SHDN

—5.3

20

µs

See Figure 5-1

Settling Time (From SHDN mode),

—50

—

µs

See Figure 5-2

Thermal Shutdown Die

Temperature

—

150

—

°C

Thermal Shutdown Hysteresis

—10

—

°C

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Operating Junction Temperature Range

-40

—

+125

°C

Steady State

Storage Temperature Range

-65

—

+150

°C

Maximum Junction Temperature

—

—

+150

°C

Transient

Thermal Package Resistances

Thermal Resistance, MSOP8

—

208

—

°C/W

Typical 4-Layer Board

Thermal Resistance, DFN8

—

41

—

°C/W

Typical 4-Layer Board with Vias

DC CHARACTERISTICS (Continued)

Boldface type specifications apply for junction temperatures of -40°C to +125°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note

1:

2:

3:

4:

Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating

effects are covered by the thermal regulation specification.

5:

Thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied,

6:

Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its

value measured at a 1V differential.

7:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

dissipation causes the device to initiate thermal shutdown.