LPC802 datasheet(70/83 Pages) NXP

70 / 83 page

LPC802

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Product data sheet

Rev. 1.6 — 27 April 2018

70 of 83

NXP Semiconductors

LPC802

32-bit ARM Cortex-M0+ microcontroller

Fig 37. Package outline HVQFN33 (5 x 5 x 0.85 mm)

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

MO-220

hvqfn33f_po

11-10-11

11-10-17

Unit(1)

max

nom

min

0.85

0.05

0.00

0.2

5.1

4.9

3.75

3.45

5.1

4.9

3.75

3.45

0.5

3.5

Dimensions (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;

32 terminals; body 5 x 5 x 0.85 mm

0.30

0.18

D(1)

A(1)

E(1)

ee1

3.5

0.1

0.05

0.5

0.3

0.05

2.5

5 mm

scale

1/2 e

terminal 1

index area

detail X

y1 C

916

terminal 1

index area

1/2 e

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